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Single Board Computer

 
 
IBR215 SBC
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i.MX 8M Plus

NXP Cortex™-A53, i.MX 8M Plus Quad 1.6GHz processor
3GB LPDDR4, 16GB eMMC & SD socket for expansion
1x HDMI 2.0a

2x USB 3.0 Type-A

2x RJ45 GbE LAN

1x Mini-USB OTG

-40°C~ 85°C

1x M.2 3052 Key-B with SIM socket (PCIe, USB3.0 for 5G module) 

2x I2C / 4x GPIO 6-pin header

1x Audio Line-in and Line-out 6-pin header

1x DC power in 4-pin header

3x IO expansion 2mm pitch 2x20 pin headers 

105mm x 70mm x 20 mm
Yocto v3.0

Android 11 

IBR210 SBC
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i.MX8M Quad 

Low-Power Multimedia IoT 3.5” SBC with NXP ARM® Cortex-A53/Cortex-M4 i.MX 8M Dual/Quad 1.5GHz Processor

Cortex™-A53/Cortex™-M4, i.MX 8M Dual/Quad 1.5GHz Processor

3GB LPDDR4, 16 eMMC

2x 4-lane MIPI-CSI

2x USB3.0

-40~85℃

SIM socket on board with mPCIe

M.2 Key-E (2230) and Mini-PCI-E w/ SIM for Wifi/4G/LTE

1x HDMI V2.0a

12~24V DC-in

146 x 102 mm, 3.5” size

Yocto v2.5  

Android 9

IBR117 SBC
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i.MX6 Dual 1GHz

Low-Power Multimedia IoT 3.5”SBC with NXP ARM® Cortex-A9 i.MX 6 Dual 1GHz Processor

Cortex™-A9, i.MX 6Dual 1GHz Processor

1GB DDR3, 4GB eMMC

3x LED for power, wireless and programable

2x CAN Bus 2.0B (w/ isolation)

-40~85℃

SIM socket on board with mPCIe

M.2 Key-E (2230) and Mini PCI-E w/ SIM  for Wifi/4G/LTE

USB touch I/F

146 x 102 mm, 3.5” size

Yocto v2.1

Android 6.0.1

IBR115 SBC
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i.MX6 Dual-Lite

Low-Power Multimedia IoT 2.5”SBC with NXP ARM® Cortex-A9 i.MX 6 Dual-Lite 1GHz Processor

Cortex™-A9, i.MX 6 Dual-Lite, 1GHz Processor

1GB DDR3, 4GB eMMC

1x LAN

-40~85℃

2x LED for power & wireless

M.2 Key-E (2230) for 4G/LTE connectivity

USB touch I/F

100 x 72 mm, 2.5” size

Yocto v2.1

Yocto v2.5

Android 6.0.1

SMARC

 
RM-N8MP SMARC2.0
RM-N8MP SMARC2.0.png
i.MX 8M Plus

NXP Cortex™-A53, i.MX 8M Plus Quad 1.6 GHz processor
3GB LPDDR4, 16GB eMMC & SD socket for expansion
External connectivity including USB, HDMI, Ethernet
Supports M.2 Key-B (3052) for 5G module
Rich IO expansion signals for IO board design to support WiFi/BT, 4G/LTE, LCD, Camera, NFC, QR-code etc.
-40°C~ 85°C with heat sink or through housing design
82 x 50 mm
Yocto v3.0
Android 11

RM-N8QM SMARC2.1 
RM-N8QM_SMC_Top.jpg
i.MX 8 QuadMax

Wide-Temperature SMARC 2.1 Module with NXP ARM® Cortex-A72/Cortex-A53/Cortex-M4 i.MX 8QuadMax eight Core 1.6GHz/1.2GHz/264MHz Processor

Cortex-A72/A53/M4 i.MX 8QuadMax eight Core 1.6GHz/1.2GHz/264MHz 

4GB LPDDR4, 8 eMMC

2x USB3, 2x USB2, 

1x LVDS 2ch, 1x HDMI In, 

-40~85℃

1x MIPI-DSI 4-lane, 1x HDMI2.0a, 2x MIPI-CSI2 4-lane, 

2x SDIO interface, 2x SPI, 2x I2S, 5x I2C, 5x UART, 

4x PCIe(x1) Gen1, 1x GbE, GPIOs

82 x 50 mm

Android 10

 
RM-N8M SMARC2.0 
RM-N8M_SMC_Top.jpg
i.MX 8M Quad

Wide-Temperature SMARC 2.0 Module with NXP ARM® Cortex-A53/Cortex-M4 i.MX 8M Dual/Quad 1.5GHz Processor

Cortex™-A53/Cortex™-M4, i.MX 8M Dual/Quad 1.5GHz processor

3GB LPDDR4, 16 eMMC

-40~85℃

1x MIPI-DSI 4-lane, 1x HDMI2.0a, 2x MIPI-CSI2 4-lane, 

1x MMC/SDIO interface, 2x SPI/eSPI, 2x I2S, 4x I2C, 4x UART, 

2x USB3, 2x USB2, 2x PCIe(x1) Gen1, 1x GbE, GPIOs

82 x 50 mm

Yocto v2.5  

Android 9

RM-N8MMI SMARC2.0 
RM-N8MMI_SMC_Top.jpg
i.MX 8M Mini Quad

Wide-Temperature SMARC 2.0 Module with NXP ARM® Cortex-A53/Cortex-M4 i.MX 8M Mini Quad 1.8GHz Processor

Cortex™-A53/Cortex™-M4, i.MX 8M Mini Quad 1.8GHz processor

2GB LPDDR4, 8 GB eMMC

-40~85℃

82 x 50 mm

Yocto v2.5  

Android 9

ARM - SOM

 
H8MM200 SOM
H8MM500.png
i.MX 8M Mini

Cortex™-A53/Cortex™-M4, Dual/Quad up to 1.8GHz processor

Graphics Processor

512MB-4GB DDR4, 8-64GB eMMC

-40~85℃

1x MIPI-DSI 4-lane, 1x MIPI-CSI 4-lane, 

2x MMC/SDIO, 2x SPI, 2x I2S, 3x I2C, 1x PCIe,

2x SAI, 4x UART, 2x USB2.0 OTG, 1x GbE LAN, GPIOs

36x49 mm

Yocto v2.5  

H8MM300 SOM
H8MM300.png
i.MX 8M Mini / Nano

Cortex™-A53/Cortex™-M4, Dual/Quad up to 1.8GHz 

Graphics Processor

512MB-3GB LPDDR4, 8-64GB eMMC

-40~85℃

3x I2S(2x forNano), 1x GbE LAN, 2x USB2.0, 4x UART, 

1x QSPI, 1x SPI, 4x I2C, 2x MMC/SDIO, 

1x PCIe(x1) Gen2, 24x GPIOs

37x39 mm

Yocto v2.5  

Android 9

H8MP500 Series 
H8MM200.png
i.MX 8M Plus

NXP Cortex™-A53, i.MX 8M Plus Quad 1.6 GHz processor

up to 4GB DDR4, up to 64GB eMMC

Machine learning accelerator for AI applications

1x MIPI-DSI 4-lane, 1x LVDS 2-ch,1x MIPI-CSI 4-lane, 

2x MMC/SDIO, 2x SPI, 2x I2S, 3x I2C, 1x PCIe,

2x SAI, 4x UART, 2x USB3.0 OTG, 2x GbE LAN, GPIOs

-40~85C or 0~65C

36x49 mm

Yocto 3.0

Android 11

Evaluation Kit

 
HX100 Carrier Board
HX100.png

Carrier Board for MX8 SMARC 2.0 and SOM modules

Rich peripheral I/O support

Complete System Available for Evaluation

-40°C ~ 85°C

146mm x 102mm

Validated w/ Yocto v2.5 and Android 9

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